Solutions to-DMS (Diminishing Manufacturing Sources) and EOL (End Of Life)
Monolithic Montage
Providing aftermarket manufacture, Testing & Screening of semiconductor devices as FFF replacements to devices made obsolete by the original OEM.
From an available stock of over 42,000 different die and wafers, we can provide solutions to many parts made obsolete by the original OEM. Over 75,000 individual product types. Our DESC or vendor qualified sub-assembly sites offer quality levels equivalent to the original manufactures. Both in assembly and/or test facilities
. parts in Commercial plastic to ceramic Mil-Std-883 and on to Space Level qualified, there is probably no company that can offer such a comprehensive level of sup
ply and capabilities.
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Service News


Re-Balling BGA
Reball to PbSn or Pb free

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"AUTHENTICARE Program"
Parts are not genuine?
Devices damaged?
W
e authenticate!!
6 levels of test!

"BOM Monitoring"
Keep your BOM current and free from Obsolescence BEFORE its too late!
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Product News
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Approved spplier of discontinued ATMEL-UVEPROM EEPROM FLASH EPLD.

Linear Tech metal can devices
Re-
Manufactured using original die.


FT offer solutions to the
dilemma in using pB free devices in military high risk equipmen
t.
Request details

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BS EN ISO9001:2000 Accredited
AS9100 approval pending
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SRAM
EEPROM
UVEPROM
PSRAM
FLASH

MICROPROCESSORS
GATE ARRAYS
LOGIC
LINEAR A/D-D/A
MCM

Module montage
Discrete montage
Probably the most comprehensive range of replacement devices for obsolete diodes and transistors.
With extensive stocks of die and wafer there is no other company capable of supporting your discrete requirements. Simple replacements to FFF alternatives to custom devices in custom packages, We offer single or multiple die configurations to complex Hybrids. In-house design to meet your requirements. Commercial, Military or Space specification. Equivalent processes to JANT(X)(V)

QPL LISTING
POWER+DARLINGTON
PNP/NPN TYPES
TUNING UHF/VHF

VARACTORS
SOLID STATE RELAYS
DELAY LINES
HYBRIDS

Assy.BI,Test facilities

MEMORY MODULE
VERSAPAC
VERSA-STACK
HALF-PAC
3D MODULE
LOGIC MODULE

ANALOG MODULE
MEGA MODULE
DENSE-STACK
TRANSLATOR MODULES
EMULATION MODULES
MCM (Multi Chip Module)

Force Technologies-European partner for the exclusive rights to all technical information, manufacturing and tooling for components previously manufactured by DPAC (Dense Pac Microsystems).
The rights to manufacture DP product under licence enables clients to maintain their specifications. Many parts can be upgraded or enhanced, if required to the latest technology. MIL-I-45208A utilising MIL-STD-883 and MIL-PRF-38535 Standards.