Teledyne uses die extraction to save DOD system

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When a critical component in a secure communications multi-chip module (MCM) became obsolete and the die no longer available, Teledyne Microelectronic Technologies was able to use extracted die from readily available packaged parts, thus avoiding a costly redesign and subsequent time consuming qualification testing.

The customer, a Department of Defense agency, had little experience using extracted die and was skeptical of the process, however extensive testing by Teledyne proved the reliability of the extracted die.

Subsequently, this process was approved by the customer for use and enabled Teledyne to extend the life cycle of the system by five years without the need for extensive modifications due to an obsolete component.

Download the full Teledyne case study.