BGA REBALLING
SPHERE REMOVAL
  • Bake
  • Remove Spheres
  • Clean
  • Visual Inspection

APPLICATION

  • Replacement of Pb/Sn with Pb free
  • Replacement of Pb with Pb/Sn
  • Reclamation from pcb (automatic)

Working Practices

 

  • IPC-A- 610D
  • IPC-771121
  • ISO 9001:2000

Click for full Process flow diagram

SPHERE REPLACEMENT

  • Clean
  • Bake
  • Dry
  • Inspect
  • Bake
  • Ball Placement
  • Flux
  • Re flow
  • Clean
  • Dry

APPLICATION

  • Eutectic Spheres Pb/ PbSn or Custom
  • 0.3MM-0.76MM
  • Pitch, 0.5 to 1.27
  • Micro BGA
  • HMP Spheres 0.76mm and larger

Working Practices

  • J-Std-033B
  • M11 cleanliness testing
  • ISO 9001:2000



 

FINAL INSPECTION/SHIP

  • Inspect
  • Alignment verification
    XRF Analysis
    X-Ray
  • Bake
  • Final Packaging Reel/Tray etc
  • Dry pack
  • Ship

APPLICATION

  • 3D-7.5Micron Accuracy(ICOS)
  • 100% inspection
  • Co planarity Scan
  • X-Ray Fluorescence 1000 ppm limit (RoHS)
  • Shear Testing (Joint)



Terms and conditions upon request.

Call Your nearest Representative for pricing and turnaround time.