Force Technologies Ltd. ensures continued support and quality of build for obsolete semiconductors, (microprocessors, Linear, memory, opto and discrete devices), through our access to a wide range of original manufacturers’ assembly, testing and custom package designs.

We use detailed information from original manufacturers and 25 years of experience in re-creation, assembly and testing, to supply high quality, reliable, replacements to obsolete components. SCD (Source Control Documents), created by Force Technologies or customers, or comprehensive data sheets give Parametric and Mechanical assurance.


Using our in-house capabilities and DESC approved partners facilitates compliance to mechanical and environmental standards; all components are assembled, tested and packaged under MIL-STD conditions. Clients in commercial, industrial, aerospace, military and space sectors can rely on Force Technologies Ltd. All elements are fully evaluated and semiconductors are assembled within closely controlled processes, using Qualified Manufacturing Lines, (QML) or DESC approved assembly therefore giving 100% quality assurance.


A vast range of packaged die options are available from Force Technologies Ltd. means continued support for diminished source or end of life components.  Bare die or wafer are lot qualified or can be probed over temperature and meet MIL-STD-883 standards. Die and wafers can be re-engineered and re-manufactured to original package designs or to cater for specific requirements lead-free or green standards.


Both in-house and contract partners’ test facilities, enables the use of an extensive list of testing methods and techniques to provide a comprehensive range of electrical, and environmental testing, for all types of semiconductors, (microprocessors, Linear, memory, discrete & opto devices). Clients can opt for original manufacturer-approved testing programs (where available) or tailored test programs to ensure quality assurance and form, fit and function.