Destructive Physical Analysis

Destructive physical analysis sample testing is performed to exacting specifications, ensuring high reliability of components and devices that are fabricated to a required standard.

Analysis collects data to help determine any items that may function out of original spec thus preventing rejection of entire lots. Screening identifies:

  • Exact construction
  • Composition
  • Quality of materials/components contained

Typical destructive physical analysis can include:

  • External visual inspection – to assess overall exterior quality and workmanship.
  • Real Time X-Ray Inspection – non-destructive detection of internal defects
  • Particle Impact Noise Detection – to detect loose particles inside a device cavity.
  • Hermetic and Internal Vapour Analysis – to quantify package integrity & internal atmosphere; methods may be used to gauge sealing processes or internal post-seal out gassing to prevent susceptibility to moisture-related failures.
  • Internal Visual Inspection via Optical Microscopy and Scanning Electron Microscopy (SEM) – to evaluate the quality of passivation, metallisation and other die related components.
  • Glassivation Layer Integrity – to assess the structural quality of deposited dielectric films over aluminium metallised devices.
  • Bond Strength – to measure wire bond strengths and evaluate bond strength distributions.