Assembly/Testing/Packaging

Assembly, Testing and Packaging

Force Technologies Ltd. ensures continued support and quality of build for obsolete semiconductors, (microprocessors, Linear, memory, opto and discrete devices), through our access to a wide range of original manufacturers’ assembly, testing and custom package designs.

We use detailed information from original manufacturers and 25 years of experience in re-creation, assembly and testing, to supply high quality, reliable, replacements to obsolete components. SCD (Source Control Documents), created by Force Technologies or customers, or comprehensive data sheets give Parametric and Mechanical assurance.

Assembly

Using our in-house capabilities and DESC approved partners facilitates compliance to mechanical and environmental standards; all components are assembled, tested and packaged under MIL-STD conditions. Clients in commercial, industrial, aerospace, military and space sectors can rely on Force Technologies Ltd. All elements are fully evaluated and semiconductors are assembled within closely controlled processes, using Qualified Manufacturing Lines, (QML) or DESC approved assembly therefore giving 100% quality assurance.

Packaging

A vast range of packaged die options are available from Force Technologies Ltd. means continued support for diminished source or end of life components.  Bare die or wafer are lot qualified or can be probed over temperature and meet MIL-STD-883 standards. Die and wafers can be re-engineered and re-manufactured to original package designs or to cater for specific requirements lead-free or green standards.

  • Vast range of packaged die options
  • Accordance  with  MIL-STD-883 standards
  • Original or specific manufacture designs
  • Laser marked for Military, Space, Aerospace, Industrial
  • Large range of package configurations including custom types

NEW Chip & Wire solutions.

Miniturisation and low cost for low to medium volumes can now be achieved using Chip & Wire bonding direct onto

Once the design / ball soldering operation is complete, it is then is processed  for all die and wire bonding using aluminium wedge, gold wedge or gold ball wire bonding depending on the technology required. Once wirebonded and tested, the assembly is then able to be encapsulated using dam & fill glob top technologies. Device types range from die having a single bond wire up to 750 wires / die and in some instances on COB devices up to 1000 wires / assembly. Furthermore when combined with our extensive SMT & test capability, Force can offer a total product solution. more

All devices are fully evaluated and semiconductors are assembled within closely controlled processes, using Qualified Manufacturing Lines, or approved assembly therefore giving 100% quality assurance by our contractors to ISO9001, ISO13485 and AS9100

Testing

Both in-house and contract partners’ test facilities, enables the use of an extensive list of testing methods and techniques to provide a comprehensive range of electrical, and environmental testing, for all types of semiconductors, (microprocessors, Linear, memory, discrete & opto devices). Clients can opt for original manufacturer-approved testing programs (where available) or tailored test programs to ensure quality assurance and form, fit and function.