Force Technologies Ltd. offers a number of standard and custom mechanical re-working services, to existing or damaged components.
Reworking or modifying components to meet the original or specific, new mechanical specification is a cost-effective way of managing the availability of obsolete semiconductors and electronic components, such as Microprocessors, Linear, Memory, discrete devices to Clients in Aerospace, Space & the Military. Force Technologies Ltd. has managed Ball attach and De-Balling/Re-Balling services. Using Laser or Sigma6 techniques
We provide options for conversion of solder spheres between lead-free and tin-lead (Sn63-Pb37 or Sn10 –Pb90) and customer returned products can be re-balled in readiness for use in existing products.
Clients can choose high or low production volumes; automated lines manage the deball/ sphere placement/ reflow process.
Quad Flat Pack (QFP), DIL and Small Outline ICs, (SOIC) component lead alignment is performed under controlled environment; reworked to standards, suitable for machine placement.
We perform qualification testing that measures acoustic microscopy, ionic cleanliness and ball shear.
Force Technologies Ltd. operates to Restriction of Hazardous Substances (RoHs) compliant working practices and applications include:
- M11 (Cleanliness)
Force Technologies Ltd. can, where appropriate, offer taping & reeling services; all batches are taped to EIA standards and are tested for peel strength; we have a vast capacity for producing tape & reel according to your specific requirements.
Top quality, high quality materials ensure a strong pocket formation and our in house YAG laser marking ensures clear identification and quality control.