IC Assembly Services for Mission-Critical Electronics
AS9100-certified IC assembly, packaging, and testing including flip-chip, wire bonding, die attach, and hermetic sealing purpose-built to support both new designs and obsolete semiconductor devices. From die recovery and re-hosting to full production, we deliver aerospace-grade reliability when standard supply chains can’t.
When Reliability Can’t Be Compromised, Assembly Matters
In defence, aerospace, and industrial applications, every microelectronic component must perform flawlessly even in the harshest environments. At Force Technologies, we specialise in small-batch, high-reliability IC assembly that meets or exceeds MIL-STD-883 and customer-specific requirements.
Whether you’re addressing obsolescence, sourcing challenges, or need custom assembly for a new design, our in-house capabilities ensure performance you can count on.
Full-Spectrum IC Assembly & Packaging Services
| Service | Details |
|---|---|
| Wire Bonding | Gold & aluminium, wedge and ball, up to 1 μm accuracy |
| Flip-Chip Assembly | Cu pillar & microbump; underfill & reflow; < 20 μm pitch |
| Die Attach | AuSn, Ag epoxy, epoxy resin; thermal profiling |
| Hermetic Sealing | MIL-STD-883 Method 1014; seam, lid & laser weld |
| Burn-In & Test | LHTOL, electrical testing, −55 °C to +125 °C |
| Custom IC Packaging | Hybrid assembly, multi-die, re-engineered legacy formats |
IC Assembly Services: Frequently Asked Questions
IC Assembly FAQs
What package types do you support?
We support ceramic, plastic, metal-can, and custom hybrid packages — including CQFP, DIP, LCC, TO, and custom leadframes.
Can you replicate or repackage obsolete ICs?
Yes we specialise in obsolescence management, reverse engineering, and re-hosting die into new package formats.
Can you perform MIL-STD-883 screening?
Yes, including methods 1010, 1014, 2010, 2011, 2009 and more. Custom screening plans available.
What’s the smallest die size you can work with?
We regularly assemble die down to 0.2 × 0.2 mm with tight bond-pad pitch.
