When semiconductors become obsolete, the exact qualified device may no longer be available. For long-life systems, this can create a gap between what the original design requires and what can still be procured. A commercial, industrial or lower-grade variant may exist, but it cannot be used in a higher-reliability application without appropriate evaluation and test evidence.
Upscreening provides a controlled route to assess available components against more demanding electrical, environmental or military-grade requirements. Force Technologies can test and screen components to the required flow, helping determine whether a suitable variant can meet the needs of your application without moving straight to redesign.
Explore whether upscreening is suitable for your component
Upscreening is a structured evaluation and test process used to assess whether an available component can meet a higher specification than its original grade. This may involve electrical testing at increased temperature, environmental testing, burn-in and screening to relevant requirements such as MIL-STD-883 Method 5004/M5005.
Depending on the device, upscreening can be applied to ceramic, metal can or plastic packaged semiconductors, with the test flow selected according to the component type and application requirement.
See upscreening explained
Frequently asked questions
What is upscreening?
Upscreening, sometimes written as up-screening, is the process of evaluating and testing an available component to determine whether it can meet a higher specification or application requirement. This can include electrical testing, environmental testing, burn-in and screening to standards such as MIL-STD-883 Method 5004 where required.
What types of components can be upscreened?
We can upscreen a wide range of semiconductor devices, including memory, microprocessors, FPGAs, and analogue components. If a test program doesn’t already exist in our extensive library, our in-house engineering team can design and implement the necessary hardware and software to support it.
Can plastic packaged devices be upscreened?
Yes, plastic packaged semiconductors can be assessed through upscreening, but the approach may differ from ceramic or metal can devices. The test flow needs to consider the device construction, package limitations and application requirements, particularly where higher-reliability or military-grade expectations apply. See our plastic upscreening page for more detail.
How do you ensure the quality and authenticity of the parts being upscreened?
All parts, whether supplied by us or by the customer, undergo rigorous goods-inward inspection and verification processes to AS6171 protocols. This ensures both authenticity and quality before any upscreening begins.
Can I submit my own components for upscreening?
Absolutely. We can test customer-owned goods as well as parts supplied through non-franchise distribution channels. Every component, regardless of source, must meet our stringent quality and traceability standards before being functionally upscreened.
Ready to discuss upscreening?
Send us your component details and we will advise whether upscreening is a suitable route for your application.