• Solutions to IC obsolescence

    Allowing supportability in design and sustainability for a products life cycle and beyond. More

  • Design Recreation

    Replacing obsoleted IC’s with new “FT”  designed, built and tested product. Licensed for maximum product availability without EOL or LTB issues.


    FPGA replication of obsolete devices by utilising modern devices to replicate the old. More

  • Upscreening

    Extending device specifications. Characterisaion of devices by means of extensive DC and functional test programs.More

  • Die Extraction & Re-assembly

    DER Die Extraction and Re-assembly FT-DER new defence approved process, is the extraction of die from any package allowing re-Packaging into any other available standard, custom or hybrid package. OEM ownerd as donors. assembly & test within FT certification processes ensure 100% compatibility Proven processes with guarantee of FT CofC. Full traceability and certification from original, Extraction and re-assembly into ideal package and then  883B or custom SCD, More

  • Chip & wire Packaging

    Chip and Wire facility offer die packaged with both SnPb or Lead-free solder for FR4 based BGA substrates Temperature 200°C with materials such as . See more…

  • Standard Designs

    Standard designs for obsolete semiconductor replacement
    Since 1995 we have produced over 900 standard designed or adapted parts for use where the OEM parts have been made obsolete. uniquely branded as "FT" vanilla products. These devices these can be seen in equipment used for: Commercial, Industrial, Aerospace and Defence. From Commercial specifications and manufactured using MIL-STD-38535 processes and tested to MIL-STD-883 standard designs. More
  • Custom Design

    Custom Design
    Custom devices designed and manufactured, both monolithic and module or MCM for customers in the: Defence, Aerospace, Industrial and commercial markets. From diodes to processors, from simple logic or memory IC's From conceptual overview, through probablility designs, to final product manufacture and test with enviroment and reliability data. More