Anti-Counterfeit Testing
UK sovereign anti-counterfeit testing for critical semiconductors
Counterfeit semiconductor risk is increasing, and exposure is not always the result of poor sourcing decisions. When critical parts become obsolete, hard to find or allocation-constrained, you may have limited routes available, especially if authorised supply is no longer possible. Counterfeit and nonconforming parts are more common than many programmes expect, particularly where demand, scarcity and long lifecycle requirements overlap.
For aerospace, defence and other critical applications, a single compromised component can affect reliability, safety, compliance and confidence in the wider system.
Force Technologies’ Sovereign Test Lab provides UK sovereign anti-counterfeit testing for semiconductor components, helping you verify the authenticity and integrity of parts before they enter your supply chain.
Testing is carried out in line with AS6171 requirements, with laboratory processes developed around the competence, reliability and traceability principles of ISO/IEC 17025. The appropriate inspection and analysis methods are selected according to the device, documentation, source and end use. This can include visual inspection, marking verification, dimensional checks, XRF analysis, X-ray inspection and decapsulation. The result is clear test data to support decision making.
Test methods
Non-destructive methods are used first, allowing parts to be assessed without immediately compromising their usability. Destructive methods can then go further where required.
Visual Inspection
Detailed external visual inspection to examine markings, surface condition and other external features, identifying signs of resurfacing, remarking or inconsistent finish.
XRF Analysis
X-ray fluorescence analysis of material composition and finish across semiconductor packages, lids and leads, detecting incorrect or inconsistent material.
X-ray Inspection
Internal examination of package integrity, wire positioning and internal construction without damaging the component.
Decapsulation
Destructive physical analysis that exposes the die and internal structure for closer inspection of the silicon, bonding and internal features.
Frequently asked questions
What is anti-counterfeit semiconductor testing?
Anti-counterfeit semiconductor testing checks whether a component is authentic, correctly marked and consistent with the expected device. It can include visual inspection, marking verification, dimensional checks, XRF analysis, X-ray inspection and, destructive analysis such as decapsulation.
When should a component be tested?
Testing is particularly useful when parts are obsolete, hard to source, allocation-constrained, purchased outside authorised supply channels or intended for a critical application. It can also support due diligence where documentation, traceability or supplier confidence is limited.
What is the difference between non-destructive and destructive testing?
Non-destructive testing assesses a component without immediately compromising its usability. This can help identify external, material or internal construction concerns. Destructive testing goes further, for example by decapsulating a device to inspect the die and internal structure.
Which standards does the Sovereign Test Lab work to?
Anti-counterfeit testing is carried out in line with AS6171 requirements. Laboratory processes are developed around the competence, reliability and traceability principles of ISO/IEC 17025.
What test methods do you use for anti-counterfeit testing?
We use a range of test methods including: detailed external visual inspection; XRF to analyse material composition and finish; X-ray to examine internal features and wire positioning; and destructive physical analysis to expose the die and internal structure.
Related insights
View allNeed assurance on component authenticity and reliability?
Our Sovereign Test Lab provides UK anti-counterfeit testing to give you confidence before parts enter your programme.