Destructive Physical Analysis
Sample-based analysis for high-reliability components
When component assurance requires evidence beyond external inspection or documentation, Destructive Physical Analysis (DPA) can provide a deeper view of the device. DPA examines the internal construction and materials of semiconductor components, supporting reliability assessment, failure investigation, counterfeit detection and wider test programmes. Because the process is destructive, it is typically carried out on sample components selected for analysis.
Force Technologies carries out DPA using controlled inspection and analysis methods selected according to the device and the question being answered. This may form part of an anti-counterfeit test, failure investigation, reliability assessment or broader component assurance programme.
Destructive Physical Analysis methods
Depending on the device and investigation requirements, DPA may include:
- External visual inspection — to assess exterior quality, condition and workmanship.
- Real-time X-ray inspection — to identify internal defects without opening the device.
- Particle Impact Noise Detection — to detect loose particles inside a device cavity.
- Hermetic and internal vapour analysis — to assess package integrity and internal atmosphere, including susceptibility to moisture-related failure.
- Internal visual inspection — using optical microscopy and SEM to evaluate passivation, metallisation and die-related features.
- Glassivation layer integrity assessment — to review the structural quality of dielectric films over aluminium metallised devices.
- Bond strength testing — to measure wire bond strength and assess bond strength distribution.
Related testing services
DPA is often used alongside or following other testing methods. You may also be interested in our anti-counterfeit testing and upscreening services.
Ready to discuss DPA?
Whether you need failure investigation, reliability assessment or counterfeit detection support, our team can advise on the right analysis approach for your components.