Manufacturing, assembly and packaging of obsolete semiconductors
Keep critical semiconductor supply moving without redesign
When a semiconductor reaches End of Life (EOL), the issue is not always solely about availability. The challenge is maintaining production, support or repair capability when existing systems still depend on proven components.
In high-reliability sectors, the alternatives are rarely straightforward and that can mean difficult trade-offs. Redesign introduces cost, delay and requalification. Alternatives bring uncertainty. And neither guarantee the performance or lifecycle your application demands.
Force Technologies provides a structured route to maintain semiconductor supply through manufacturing, packaging and assembly services tailored to solve obsolescence and end-of-life requirements.
This service allows you to continue supporting equipment, contracts and programmes without defaulting to redesign or sourcing.
- Form, fit and function replacements
- Built in accordance with MIL-PRF-38535, MIL-STD-883 and DESC standards
- Secure, long-term supply continuity, extending beyond 20 years
- Packaging aligned to application, environment and system constraints
- Potential for improvements to existing package footprint, and enhanced thermal or environmental performance
The outcome is practical and immediate: reduced downtime risk, continued production capability, and confidence that replacement components will perform as required.
Manufacturing
When original components are no longer available, a reliable manufacturing path gives you continuity of production and repair capability — without defaulting to redesign or uncertain sourcing.
- Replacement ICs that meet or improve required form and functionality
- MIL-PRF-38535, MIL-STD-883 and DESC standards
- Control over all component parts: package, lid, adhesives, die
Packaging
Package selection is often where replacement strategies fail. Force Technologies supports a wide range of ceramic, plastic and specialist packages, always focused on what will actually work in the target application.
- Ceramic, plastic and specialist package options
- Custom tooling and lead forming available
- JEP95/JEDEC and other industry standard outlines
Assembly
Assembly is where the replacement semiconductor becomes an operational device. Through in-house capability and QML certified approved partners, Force Technologies provides assembly solutions for commercial, industrial, aerospace, military and space applications.
- Full assembly and test to MIL-PRF-38535
- Burn-in, life testing, shock and vibration
- Hermetic and moisture resistance qualification
Resources
Further reading on manufacturing, assembly and packaging
Ready to solve your obsolescence challenge?
Whether you need manufacturing, packaging or assembly support, our team is ready to help you find a sustainable path forward.