Assembly
Semiconductor assembly and post-assembly test for commercial, industrial, aerospace, military and space
Assembly is where the replacement semiconductor becomes an operational device. It is also where many programmes encounter risk if the process is not properly controlled. For high-reliability applications, the quality and traceability of assembly work is as important as the design of the device itself.
Force Technologies provides assembly solutions through a combination of in-house capability and QML certified approved partners. This gives access to the full range of assembly flows required for military, aerospace and space applications, alongside standard commercial and industrial flows.
Each assembly programme is managed with close attention to the testing requirements of the target application. For defence and aerospace programmes, components are typically assembled and tested to MIL-PRF-38535 and MIL-STD-883, with the appropriate class level selected based on the criticality and environmental demands of the end system.
Assembly capabilities include:
- Die attach and wire bonding for ceramic and plastic packages
- Seam seal, solder seal and glass sealing for hermetic packages
- Burn-in, life testing, shock and vibration testing
- Constant acceleration and hermetic seal testing
- MIL-PRF-38535 Class B, Class S and Class V flows
- QML-certified processes via approved partner network
Markets served
Commercial
Standard assembly flows for industrial and commercial electronics.
Industrial
Extended temperature and environmental qualification.
Aerospace
Flight-qualified assembly to relevant MIL-PRF-38535 classes.
Military
Full MIL-STD-883 compliant test flows for defence applications.
Space
High-reliability assembly with extended screening and qualification.
Frequently asked questions
What sort of testing should be done on semiconductors after assembly?
The type of testing that should be completed on semiconductors after assembly is dependent on a range of factors such as end application, safety criticality and project demands. Ceramic packages are most commonly used for Defence & Aerospace applications, where many components can be safety and flight critical. For this reason, we complete Mil-Std 5004 and 5005 testing in accordance with MIL-PRF 38535 to ensure our components can withstand the harshest of operating environments as they would in the end application. Examples in these testing flows include 1,000 life testing, burn in testing, life cycle testing, shock and vibration testing and constant acceleration testing to name a few. Additionally, ceramic packages are hermetically sealed therefore they are tested to ensure the hermetic seal has been completed correctly. Plastic packages can also be tested to Mil-Std/883 specifications, but additional testing is required for plastic packages due to the moisture and humidity risks associated with plastic packages. Examples of these tests include HAST (Highly Accelerated Stress Test).
Ready to discuss your assembly requirements?
Tell us about your application, criticality level and target environment and we will outline the right assembly and test flow for your programme.