This month’s chip of the month is the FT800. The FT800 is of particular interest as it was created from our die extraction process and after a lengthy qualification period with our end customer you can find it supporting complex radar subsystem operations.
It is by far the most complex extraction/assembly we have performed with the die having over 560 pads spaced no further away than 60um (which is about equivalent to a human hair!) This combined with the fact it required over 250 individual compound ball bonds made it quite the engineering feat.
Written by
Ben SavageApplications Manager, Force Technologies
Ben Savage joined Force back in 2006, starting out as a technician and now holds the title of Applications Manager. Boasting 20 years living and breathing obsolete semiconductors, his day-to-day role is heading up the daily engineering requirements that get sent in from our global customer base.
When not working, Ben can be found spending time with his wife, two children and various hobbies.
Certifications:
Ben holds Member level with The Institute of Obsolescence Management and has written and presented numerous presentations/blogs over the years detailing Force products/services and new technologies.
Social Media:
You can keep up to date with Ben’s thoughts and get in touch with him via LinkedIn: