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Force Technologies
Silicon wafer in semiconductor test equipment

Upscreening and Device Characterisation

Test, screen and characterise available semiconductor devices

When the original qualified component is obsolete or not available to procure, testing can help identify whether an available device is suitable for your application. Upscreening, plastic upscreening and device characterisation each provide a different route to assessing component performance, reliability and suitability. Force Technologies can help define the appropriate test approach, giving you clearer evidence before committing to redesign, production or further qualification.

Upscreening

Where the exact qualified device is no longer available, upscreening can assess whether another grade or variant is capable of meeting more demanding electrical, environmental or application requirements.

Plastic upscreening

Plastic packaged devices are widely available, but using them in applications originally designed around higher-grade or hermetic components can require additional evaluation and testing. A tailored screening programme can provide evidence of how the device performs against the required conditions.

Device characterisation

Device characterisation measures component behaviour against specified parameters, helping engineers establish performance where existing data is insufficient or where an alternative device is being considered.

Technician inspecting a semiconductor chip under a microscope

Upscreening

Qualify available components for higher-reliability applications.

Read more about upscreening
Close-up of a plastic-encapsulated semiconductor package

Plastic Upscreening

Assess PEMs for higher-reliability use where hermetic options are limited.

Read more about plastic upscreening
Silicon wafer showing iridescent die patterns

Device Characterisation

Confirm device behaviour against known performance parameters.

Read more about device characterisation

Which testing approach do you need?

The right approach depends on what you need to establish about the component.

If an available semiconductor needs to demonstrate performance against a higher specification or grade, upscreening may be appropriate.

Where the available device is supplied in a plastic package and is being considered for a higher-reliability application, plastic upscreening can address the particular considerations associated with plastic packaged semiconductors.

If the requirement is to understand how a device behaves across defined electrical or environmental conditions, rather than to screen it to a particular grade, device characterisation may be the more appropriate route.

In some cases, more than one type of evaluation may form part of the overall test programme.

Your situationRouteWhat it tells you
A lower-grade ceramic or metal can variant is availableUpscreeningWhether the device meets the more demanding electrical, environmental or military-grade requirement
Only a plastic packaged device is availablePlastic upscreeningWhether a PEM is fit for the application, allowing for moisture sensitivity and temperature performance
Documentation is limited or a substitute is being assessedDevice characterisationHow each device behaves against OEM data, known-good reference samples or your own parameters

Testing as part of an obsolescence solution

Semiconductor obsolescence does not always mean that a system needs to be redesigned.

An alternative grade, package or device may remain available even when the original qualified component has reached end of life. Before that alternative can be considered for use, however, engineers need suitable evidence that it can meet the requirements of the application.

Testing can help establish that evidence.

Depending on the component and requirement, this may include electrical testing, environmental testing, screening or detailed characterisation. The test flow should be selected around the device and the application rather than applying the same process to every component.

For long-lifecycle aerospace, defence, rail and industrial systems, this can provide another route to maintaining component continuity while avoiding unnecessary redesign.

Frequently asked questions

Common questions about semiconductor testing, upscreening and device characterisation

What is the difference between upscreening and device characterisation?

Upscreening assesses whether a component can meet a higher specification or application requirement than its original grade. Device characterisation is used to establish how a semiconductor performs across defined parameters or operating conditions. The two approaches can overlap, but they answer different engineering questions.

How do I know which semiconductor testing approach I need?

This depends on the component, its existing specification and what you need to demonstrate. For example, you may need to establish performance at a wider temperature range, assess a plastic packaged device for a higher-reliability application or understand how an alternative component behaves against defined parameters. Force Technologies can review the requirement and help define an appropriate test approach.

Can testing help when a semiconductor has become obsolete?

Yes. In some cases, the exact qualified component may no longer be available, but another grade, package or variant may still exist. Appropriate testing can help determine whether that available device is suitable for the intended application.

Can Force Technologies develop a test programme for my component?

Yes. Test requirements can be defined around the semiconductor, the parameters that need to be assessed and the requirements of the application. Where appropriate, Force Technologies can develop the necessary test programme, hardware and software.

Not sure which test approach you need?

Send us the component details and application requirements and we can help identify the most appropriate route before you commit to redesign or production.

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