Semiconductor test services
MIL-STD-883 Testing
Screening that proves semiconductors will survive the environment they are fitted into — to a class classification grade or to your own drawing. AS9100 Rev D.
What is MIL-STD-883?
MIL-STD-883 is a standard that establishes uniform methods, controls and procedures for testing microelectronic devices intended for use within military, space and aerospace systems. It is published by the United States Department of Defense. It includes numerous environmental and mechanical tests that ensure assembled batches of semiconductor devices meet a uniform level of quality and reliability, and are therefore suitable for the end application.
What does a MIL-STD-883 Class B screen involve?
A class level B screen takes each batch through a fixed sequence of inspections and stress tests, each designed to expose a different kind of weakness before the parts reach a customer. The table gives an overview. It is not a complete description of the standard.
| Stage | What happens | Why it matters |
|---|---|---|
| 1. Internal visual (precap) | The die and its attachment are inspected under high magnification before the lid is sealed | Finds deformities that cannot be seen once the package is closed |
| 2. Temperature cycling | Devices are moved between hot and cold in a thermal chamber | Attempts to induce failure in weak parts |
| 3. Constant acceleration | Devices are placed in a centrifuge at a fixed acceleration | Exposes mechanical or structural weakness |
| 4. External visual | Each device is inspected for damage | Confirms nothing was harmed by the stress tests |
| 5. Electrical test | Devices are tested before burn-in | Sets the baseline |
| 6. Burn-in | Devices are exercised at high temperature and voltage for a minimum of 160 hours at 125°C | Removes early failures, known as infant mortality |
| 7. Final electrical test | Devices are tested against the datasheet | Confirms conformance to the characteristics ordered |
| 8. Fine and gross leak | Seal integrity is checked | Confirms resistance to moisture and other contaminants |
| 9. Final visual, mark and documentation | The batch is laser marked and paperwork prepared | Provides traceability on delivery |
Where a customer requests it, the batch continues to Method 5005 group testing.
What is the difference between Class B and Class S?
Class level B is the screening level most military and aerospace customers request, and class level S is the more demanding level associated with space applications. Under MIL-PRF-38535 these correspond to Class Q (level B) and Class V (level S). The difference shows in the detail of the flow. For example, the MIL-PRF-38535 screening table lists burn-in at 160 hours at 125°C for level B against 240 hours for level S, and adds tests such as Particle Impact Noise Detection (PIND) at level S.
| Class level B | Class level S | |
|---|---|---|
| Typical use | Military and aerospace | Space |
| MIL-PRF-38535 class (hermetic) | Class Q | Class V |
| Burn-in (TM 1015) | 160 hours at 125°C minimum | 240 hours at 125°C |
| PIND (TM 2020) | Not required | Required on each device |
Can plastic parts be tested to military standards?
Yes, plastic encapsulated microcircuits (PEMs) can be screened using flows written for non-hermetic devices. MIL-PRF-38535 defines Class N (level B) and Class P (level S) for PEMs, with seal tests replaced by X-ray or acoustic microscopy. Force Technologies also offers a high-reliability plastic screen for customers who can accept a non-hermetic solution but need the quality and reliability that military processing offers. See plastic upscreening for the full screening table.
Who needs MIL-STD-883 testing?
MIL-STD-883 testing is needed by any programme that must prove its semiconductors will survive the environment they are fitted into. In practice that means defence, aerospace, space and other long-life, safety-critical systems. It is most often requested in three situations.
- Replacement devices. A re-manufactured or form fit function replacement part must be screened to the same level as the original it replaces.
- Upscreening. A commercial or industrial variant is being assessed for a higher-reliability role. See upscreening.
- Stored or sourced stock. Parts from long-term storage or non-franchise channels need test evidence before use.
How does Force Technologies carry out MIL-STD-883 testing?
Force Technologies carries out MIL-STD-883 testing on its own replacement solutions and on customer-supplied components. The aim on every request is full coverage against the customer's requirement, with no concessions. Parts pass goods-inward inspection before testing begins, and the flow is set either by class classification grade or by the customer's custom drawing. Our Applications Manager, Ben Savage MIIOM, has worked on obsolete semiconductors at Force since 2006 and leads the engineering response to these requests.
Discuss your test requirement
Send us the part number, the class level or drawing you need to meet, and the quantity. We will confirm the test flow and tell you if a different route would serve the programme better.
Frequently asked questions
What is the difference between MIL-STD-883 and MIL-PRF-38535?
MIL-STD-883 defines the individual test methods. MIL-PRF-38535 is the performance specification that sets out which of those methods apply to each device class.
What is burn-in testing?
Burn-in exercises devices at high temperature and voltage for an extended period to remove weak devices before delivery. For a class level B screen the minimum is 160 hours at 125°C.
Do you test customer components?
Yes. Customer-owned goods can be tested, subject to goods-inward inspection and verification to AS6171 protocols.