At Force Technologies, we understand the complexities of semiconductor obsolescence and the challenges companies face when critical components go end-of-life. As part of our mission to deliver comprehensive semiconductor solutions, we’ve developed a range of services specifically for Xilinx FPGAs. Today, we’d like to take you behind the scenes on how we successfully solved a unique challenge for one of our clients.
Understanding the Client’s Challenge: The Need for XC3042-100PG84B Replacements
Our client faced a pressing need: an ongoing requirement for the obsolete XC3042-100PG84B Xilinx FPGA, an essential component in their system. Like many companies dealing with end-of-life components, they had exhausted available market stock and were in search of a reliable, long-term replacement solution. When they reached out to us, they needed a partner with the technical knowledge, resources, and capacity to produce a reliable and compatible replacement.
Leveraging Force Technologies’ Xilinx Expertise
With years of experience in Xilinx technologies, access to a team of former Xilinx engineers, original Xilinx base materials, and custom test programs allowed us to offer an unparalleled solution. We’ve invested heavily in Xilinx-specific equipment, including advanced tools for functional verification, upscreening, characterisation, and FPGA-to-FPGA conversion. This infrastructure positioned us perfectly to address our client’s need for a functional and cost-effective solution.
Presenting Viable Options
We proposed two paths for the client:
- Die Extraction and Assembly: This approach involved extracting the die from existing XC3042 base materials, then re-packaging it to match the required specifications.
- Full Product Redesign: Alternatively, we could redesign the product from the ground up, but this would have involved a significant timeline of 9–12 months for prototypes, plus additional time for review and production.
After reviewing both options, the client chose the Die Extraction and Assembly method as the best fit for their timeline and requirements.
The Solution in Action: Die Extraction and Assembly of the FT3042
Our solution focused on re-creating the client’s needed part, the FT3042, by carefully extracting the die from our XC3042 stock. Here’s how the process unfolded:
- Base Material Preparation: We began by extracting a sample die from our XC3042 stock, housed in a PQFP package.
- Die Cleaning and Dressing: Our team meticulously cleaned, dressed, and prepared the extracted die for the next phase.
- Die Attachment and Rehousing: Using specialised techniques, we reattached the die and housed it within a Ceramic Pin Grid Array that exactly matched the original Xilinx footprint.
Rigorous Testing for Reliability
We performed extensive testing to ensure the new component met and exceeded quality expectations. This included:
- Environmental Testing to Mil-Std 883 M5004: Tests included die shear, bond pull, constant acceleration, temperature cycling, and burn-in.
- Application Qualification: After meeting all internal standards, the product went through an application-specific qualification by the client.
The results were impressive: the FT3042 performed identically to the original part, meeting the client’s stringent requirements for form, fit, and function.
Ensuring Long-Term Availability with Inventory Management
Our client had another challenge: they depended on end-customer orders and schedules, which meant demand could fluctuate unpredictably. To help them manage this uncertainty, we proposed a stock arrangement where we would store additional base material for future use. The client agreed, and we now hold thousands of pieces of moisture-sensitive base material in a strictly monitored, nitrogen-controlled environment, ensuring longevity and quality.
Our controlled storage process meets J-Std 033 and JEP160 standards, maintaining the base material in sub-5% relative humidity at stable temperatures. We routinely check stored components to confirm they remain in peak condition, ready for assembly upon request.
Achieving Customer Satisfaction and Long-Term Success
Since the start of this project in early 2015, we’ve been producing FT3042 units to the client’s exact specifications. Today, we’re proud to support their application’s life cycle with a reliable, high-quality replacement for the original XC3042. Thanks to our strategic inventory solution, they can count on us to supply these components as needed, regardless of market fluctuations.
Have a Component Challenge? We’re Here to Help
This project exemplifies our commitment to solving semiconductor obsolescence challenges with expertise, innovation, and dedication to quality. If you’re facing a similar issue, our team at Force Technologies is ready to help you find the right solution. Contact us at Sales@forcetechnologies.co.uk to discuss your semiconductor needs and let us work with you to secure your technology’s future.