Today, I’d like to take a moment to discuss how Force Technologies supports the increasing demand for MIL-STD 883 and other high-reliability semiconductor qualifications.
For those unfamiliar, MIL-STD 883 is a military standard that establishes uniform test methods for microelectronic devices used in military, space, and aerospace systems. It defines a wide range of environmental, electrical, and mechanical tests to ensure semiconductor components meet strict reliability and performance standards. These tests ensure that every assembled batch of semiconductors is of the highest quality and suitable for critical applications.
Meeting the Diverse Needs of MIL-STD 883 Testing
There is an extensive array of test methods (TMs) within MIL-STD 883, with specific requirements depending on a customer’s environmental, mechanical, and electrical specifications. The type of device also plays a key role in determining which tests are necessary. Below is a brief overview of how Force Technologies ensures full compliance with MIL-STD 883 without compromise.
We provide testing for Class Q (B), Class V (S), and Class Y (S) components, with a particular focus on Class Q (Class B screening), as it is the most commonly requested level of qualification.
Additionally, for customers who require a non-hermetic solution but still demand high reliability, Force Technologies has developed Relplas™—a proprietary high-reliability plastic screening process that follows MIL-STD testing methodologies while offering a cost-effective alternative.
A Closer Look at the MIL-STD 883 Class B Testing Process
To provide a better understanding of the Class B screening process, here’s an outline of the key steps involved in semiconductor testing:
Precap Visual Inspection
Before sealing the semiconductor package, a high-magnification inspection is performed to identify any defects that could impact long-term reliability.
Temperature Cycling
The components are placed in a thermal cycling chamber, transitioning between extreme hot and cold temperatures. This process helps identify potential failures due to thermal stress.
Constant Acceleration Testing
To simulate real-world environmental conditions, the semiconductors are subjected to a centrifuge test that applies controlled acceleration forces. This identifies any mechanical or structural weaknesses.
External Visual Inspection
Once acceleration testing is completed, a detailed external inspection is conducted to check for any physical damage before proceeding to electrical testing.
Electrical Testing
The devices undergo a full electrical test to verify they function within the specified parameters before entering burn-in testing.
Burn-In Testing
One of the most crucial stages, burn-in testing involves subjecting the devices to high temperature and voltage for an extended period (typically 160 hours at 125°C minimum). This process detects early failures (infant mortality) and removes weak devices before they reach the customer.
Final Electrical Testing
After burn-in, another round of electrical testing is conducted to ensure the devices still meet datasheet specifications and function correctly.
Fine & Gross Leak Testing
This test confirms the semiconductor is sealed to specification using a combination of pressure chamber testing and Freon bath immersion. It ensures the product is resistant to moisture and contaminants.
Final Visual Inspection, Laser Marking & Documentation
A final visual inspection is conducted before the semiconductors are laser marked and prepared for shipment with full documentation.
Beyond MIL-STD 883: Custom Testing & Full Compliance
For customers requiring extended qualification, we also offer M5005 group testing—a process we can discuss in further detail if needed. The key takeaway is that Force Technologies provides the full range of MIL-STD 883 testing, either to official classification levels or custom specifications based on customer requirements.
If you’re looking for a trusted partner to support MIL-STD 883 semiconductor testing and replacement solutions, we are here to help. Get in touch to find out more.