Force Technologies are now able to offer a reliable, cost-effective, high-volume die recovery or de-capping technology. This allows the removal of a silicon die from any package and re-assemble into any other plastic and or Hermetic Ceramic JEDEC, metal can or custom package. This technology provides many potential solutions targeting the need for part re-creation and microcircuit re-fabrication, both current topics pertinent to resolving EOL/Obsolete and DMS issues. The die extraction/de-capping process is proven to be a reliable and cost-effective solution semiconductor obsolescence.
Post successful die extraction the original gold wire is trimmed just above the original gold ball bond. This provides a clean uncontaminated gold surface for high adhesion re-bonding.
The only subsequent non-standard assembly process is that a new gold ball bond is made to the existing gold ball bond surface, rather than to the original pad interface. Under proper process optimisation, the new gold bond on the existing gold ball bond adheres as the original device. Subsequent compound bonds meet or exceed MIL-STD-883 2011.9.
We also offer a high temperature Ni/Pd/Au pad re plating process suitable up to 250°C.
Subsequent environmental/parametric testing testing to SCD, data sheet or customer drawing can then be undertaken.
Devices utilising the extraction and assembly method are always supported and marked with the Force Technologies PN/QMXXXX number, relating to the processes/testing performed and to uniquely identify the component manufacture type.
Harvested die placed in Gel-Pak Vacuum Release™ can be stored in Force Technologies international storage locations under controlled environments ready for assembly and test when needed by the end user.
Red: Originally Non-Bonded Pad Still Not Bonded
Green: Originally Non-Bonded Pad Now Bonded
Yellow: Previously Bonded Pad Now Bonded
Pink: Previously Bonded Pad With a New Compound Bond