Destructive Physical Analysis
Destructive physical analysis sample testing is performed to exacting specifications, ensuring high reliability of components and devices that are fabricated to a required standard.
Analysis collects data to help determine any items that may function out of original spec thus preventing rejection of entire lots. Screening identifies:
• Exact construction
• Quality of materials/components contained
Typical destructive physical analysis can include:
• External visual inspection – to assess overall exterior quality and workmanship.
• Real Time X-Ray Inspection – non-destructive detection of internal defects
• Particle Impact Noise Detection – to detect loose particles inside a device cavity.
• Hermetic and Internal Vapour Analysis – to quantify package integrity & internal atmosphere; methods may be used to gauge sealing processes or internal post-seal out gassing to prevent susceptibility to moisture-related failures.
• Internal Visual Inspection via Optical Microscopy and Scanning Electron Microscopy (SEM) – to evaluate the quality of passivation, metallisation and other die related components.
• Glassivation Layer Integrity – to assess the structural quality of deposited dielectric films over aluminium metallised devices.
• Bond Strength – to measure wire bond strengths and evaluate bond strength distributions.