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Unit 3 Garlands Trading Estate, Cadley Road, Collingbourne Ducis, Wiltshire, SN8 3EB UK

Destructive Physical Analysis

Destructive Physical Analysis

Destructive physical analysis sample testing is performed to exacting specifications, ensuring high reliability of components and devices that are fabricated to a required standard.
Analysis collects data to help determine any items that may function out of original spec thus preventing rejection of entire lots. Screening identifies:

• Exact construction
• Composition
• Quality of materials/components contained

Typical destructive physical analysis can include:

• External visual inspection – to assess overall exterior quality and workmanship.
• Real Time X-Ray Inspection – non-destructive detection of internal defects
• Particle Impact Noise Detection – to detect loose particles inside a device cavity.
• Hermetic and Internal Vapour Analysis – to quantify package integrity & internal atmosphere; methods may be used to gauge sealing processes or internal post-seal out gassing to prevent susceptibility to moisture-related failures.
• Internal Visual Inspection via Optical Microscopy and Scanning Electron Microscopy (SEM) – to evaluate the quality of passivation, metallisation and other die related components.
• Glassivation Layer Integrity – to assess the structural quality of deposited dielectric films over aluminium metallised devices.
• Bond Strength – to measure wire bond strengths and evaluate bond strength distributions.