When it comes to supporting obsolete integrated circuits, much of the industry conversation revolves around sourcing functionally equivalent devices. However, an equally critical and often overlooked aspect is ensuring the availability of directly equivalent IC packaging solutions. A replacement device that matches functionality but fails to integrate mechanically or environmentally can be just as unusable as a non-functional part.
At Force Technologies Limited, we have spent decades developing comprehensive IC packaging solutions that address this challenge head-on. Our approach combines proactive inventory management, strategic partnerships, and innovative engineering to deliver practical, cost-effective packaging options that meet the stringent requirements of Aerospace, Defence, Commercial, and Industrial applications.
Strategic Inventory of Legacy Packages
One of our core strategies is the preservation of legacy packaging technologies. By investing early in high-demand, obsolete packages, we maintain a robust stock of rare and hard-to-source package types. Our inventory includes:
- CERDIP
- Cerquad
- CQFP
- UVEPROM-compatible Windowed CERDIPs
These packages, many of which have been supported continuously for over 20 to 30 years, are critical to customers requiring drop-in replacements with exact mechanical, thermal, and electrical compatibility.
Tooling for Long-Term Sustainability
When original packaging is not available from stock, Force offers both soft and hard tooling for ceramic packages, available in low or high volumes depending on the need. Thanks to long-standing relationships with leading package manufacturers, our retooled components meet or exceed OEM standards in quality and reliability. Once a package is retooled, it becomes a sustainable solution, providing long-term assurance against obsolescence.
IC Packaging Solutions for Plastic Formats
Supporting plastic packages, especially in Commercial and Industrial environments, presents additional challenges. Traditional plastic packaging requires three separate tooling processes:
- Book Mold Tooling (package formation)
- De-Junk Tooling (removal of excess material)
- Shear and Form Tooling (lead trimming and forming)
These tools can cost $50,000 to $100,000 each, making them financially unviable for many low- to mid-volume legacy programs.
To solve this, Force offers an innovative alternative: FR4-based laminate packaging. This involves creating a footprint-compatible laminate substrate that acts as a direct replacement for the original plastic package. After wire bonding the die and conducting necessary testing, the device is encapsulated using dam-and-fill glob-top technology.
This method provides a highly reliable, cost-effective IC packaging solution with customisable finishes and coatings tailored to meet the durability and performance needs of harsh operating environments.
Ready to Support Your Obsolescence Needs
Whether you’re dealing with a critical aerospace system or an industrial automation device, ensuring packaging continuity is key to maintaining operational integrity. Force Technologies stands ready to assist with your IC packaging solution needs from legacy ceramic types to advanced custom plastic replacements.
For tailored support or to discuss a specific part requirement, our expert technical team is always available at sales@forcetechnologies.co.uk.
Stay safe, and thank you for continuing to trust Force Technologies as your obsolescence partner.