Meeting the Challenges of Obsolescence with Semiconductor Packaging
For nearly 40 years, Force Technologies has been at the forefront of providing innovative semiconductor solutions, particularly for industries facing the challenges of obsolete components. With expertise spanning the defence, aerospace, and industrial sectors, Force Technologies excels in assembling bare die into a variety of package types while ensuring compliance with stringent testing requirements.
Comprehensive IC Packaging Solutions
Force Technologies offers a wide range of packaging solutions, catering to the unique needs of its customers. Whether it is a traditional Dual Inline Package (DIP), an advanced Ball Grid Array (BGA), or high-reliability ceramic packages such as CERDIP and CQFP, Force Technologies can assemble the required die into the most suitable form factor. The selection process considers essential factors such as thermal performance, electrical characteristics, mechanical protection, size constraints, and cost-effectiveness to ensure optimal performance.
Custom Testing to Any Specification
Post-assembly testing is a critical component of the semiconductor manufacturing process. Force Technologies conducts rigorous testing procedures to meet diverse industry standards, including:
- Mil-Std-883 (M5004/M5005) testing for defence and aerospace applications, ensuring the highest levels of reliability.
- Burn-in, life cycle, shock, vibration, and constant acceleration testing to validate the robustness of components in harsh environments.
- Hermetic seal verification for ceramic packages to guarantee long-term environmental protection and seal.
- Custom test flows to meet the exact needs of each client, including commercial, industrial, and military-grade requirements.
Case Studies: Proven Success in Custom Packaging and Testing
Case Study 1: FT54HCT161DMB – Mil-Grade Custom Assembly
A leading aerospace manufacturer required continued support for the CD54HCT161 synchronous counter, which had become obsolete. Force Technologies successfully sourced the RCA/Harris die, packaged it into a 16-lead CERDIP, and ensured compliance with Mil-Std M5004 B Processing. When the CERDIP package became difficult to source, we transitioned to a side-brazed ceramic package, maintaining compliance with Mil-Std-883 testing, including hermeticity assessments. This case study particularly outlines Force Technologies’ commitment to a continuous support philosophy.
Case Study 2: FT28C010 – Long-Term Die Banking for Custom Packaging
To support long-term demand for the AT28C010 and X28C010 EEPROMs, Force Technologies banked wafers and provided assembly into multiple ceramic package types such as CLCC, Flat Pack, and Side-Brazed DIP. Testing was tailored to Mil-Std-883 M5004/M5005, ensuring operational reliability across commercial, industrial, and military temperature ranges.
Case Study 3: FT28C256 – Custom Packaging and Parts on Demand
To support a long-term project, Force Technologies banks wafers, packages, and lids in their long term storage facilities, including AT28C256 EEPROMs and 28 Lead Side Brazed Packages. Once assembled, this product undergoes Mil-Std-883 M5004 testing. Due to the long standing relationship with the customer, and oversight of their project schedule, Force Technologies is able to build and deliver according to project needs and customer demands.
This case demonstrates our commitment to going the extra mile—thinking ahead, offering flexible solutions, and ensuring continuity of supply for even the most complex and time-sensitive projects.
Why Choose Force Technologies?
- Custom Assembly for Any Package Type – Ability to package bare die into both plastic and ceramic formats.
- Extensive Testing Capabilities – Ensuring components meet the highest reliability and performance standards.
- Long-Term Support and Material Banking – Securing the availability of critical components for years to come.
- Flexibility to Meet Customer Specifications – Tailored solutions for commercial, industrial, and military applications.
Force Technologies remains committed to providing cost-effective, high-quality semiconductor solutions for industries facing supply chain challenges. Whether it is assembling a bare die into a package or executing rigorous testing protocols, Force Technologies delivers excellence at every stage of the process.