When sourcing semiconductors for safety-critical applications, the level of testing you apply to incoming components can be the difference between a product that performs and one that fails in service. The AS6171 standard exists to give you that choice, setting out a clear framework of risk levels that scale testing up or down depending on what your application demands.
In this clip from our Force Tech Talk Now podcast, Ben Savage, Applications Manager at Force Technologies, explains how AS6171 risk levels work in practice and why choosing the right level matters.
What is AS6171 and How Does It Define Testing Risk Levels
AS6171 is the standard that defines risk-based testing levels for suspect or counterfeit electronic components. It sets out a tiered structure running from low risk through moderate risk to high risk, allowing the customer to match the depth of testing to the criticality of their application.
As Ben explains, it is ultimately the customer’s decision. The standard provides the framework, but the application defines how far you go. A commercial product and a component destined for an aerospace flight system will require very different levels of scrutiny.
What Does Moderate Risk Testing Involve
Most of the industry operates at the moderate risk level. This maps closely to AS6081A testing with the addition of electrical testing on top of the standard visual, mechanical, and analytical inspections.
For many applications, this level strikes the right balance between thoroughness and practicality. It catches the most common indicators of counterfeit or substandard components without requiring the destructive testing methods reserved for the highest risk tier.
When Should You Scale Up to High Risk Testing
High risk testing under AS6171 is reserved for the most critical applications, such as aerospace, defence, and medical systems where component failure could have serious consequences. At this level, testing scales up to include burn-in and destructive batch testing designed to identify infant mortality failures before components ever reach the production line.
The purpose of destructive testing at this tier is to prove that a batch is fit for purpose under the conditions it will face in service. If a component cannot survive accelerated stress testing in a controlled environment, it has no place in a safety-critical system.
Why Choosing the Right Testing Level Matters for Your Supply Chain
The flexibility built into AS6171 is deliberate. Not every component needs the same level of scrutiny, and applying high risk testing across the board would be neither practical nor cost-effective. What the standard does is give procurement and engineering teams a structured way to make that decision based on evidence rather than guesswork.
Talk to Our Applications Team
If you are sourcing components for a critical application and need guidance on which AS6171 risk level is appropriate, contact our applications team. We can advise on testing scope and carry out the work in our own laboratory.