This month’s chip of the month is the FT800. The FT800 is of particular interest as it was created from our die extraction process and after a lengthy qualification period with our end customer you can find it supporting complex radar subsystem operations.
It is by far the most complex extraction/assembly we have performed with the die having over 560 pads spaced no further away than 60um (which is about equivalent to a human hair!) This combined with the fact it required over 250 individual compound ball bonds made it quite the engineering feat.